Announcement PDF Enabling the Future of Semiconductors AI1:ASX Semiconductor Conference 2025 May 2025 1 Disclaimer Disclaimer This information contained in this presentation has been prepared by Adisyn Ltd (ACN 155 473 304) (ASX:AI1 or Future performance any forward looking statements, opinions and estimates provided in this presentation are ‘the Company’) and makes statements about it as well as its subsidiaries, the presentation is for information based on assumptions and contingencies which are subject to change without notice, as are statements about purposes only. This presentation does not constitute financial product or investment advice or a recommendation market and industry trends, which are based on interpretations of current market conditions at the date of this to acquire AI1 shares and has been prepared without taking into account the objectives, financial situation or presentation. 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All other registered or unregistered trademarks mentioned in this presentation are the property of given as to the accuracy, completeness or correctness, likelihood of achievement or reasonableness of any their respective owners, and no trademark rights to the same are claimed. forecasts, prospects or returns contained in this Presentation nor is any obligation assumed to update such information. Such forecasts, prospects or returns are by their nature subject to significant uncertainties and Financial Data - All dollar values are in AUD dollars (AUD or $) and are unaudited (unless otherwise presented). contingencies. This presentation has been authorised for release on the ASX by the Board of Directors of AI1. 2 Who is Adisyn Adisyn Ltd is publicly listed on the the Australian Securities Exchange (ASX) under the ticker AI1 Field of activity 1. Corporate Snapshot Through 2D Generation (a fully owned • Share Price (A$)*: 0.049 subsidiary) – development of novel • Market Cap (A$)*: 35.4M technologies and methods to produce high- • Enterprise Value (A$): 25.9M quality graphene, in a low-temperature • Cash (A$)^: 9.5M process, targeting semiconductors 2. interconnect and other applications. Board of Directors Original activity of building and deploying IT • Kevin Crofton – Chairman solutions, disaster recovery solutions, and • Arye Kohavi – Director, CEO of 2D Generation end-to-end cyber security solutions. • Dominic O'Hanlon – Non-Executive Director • Blake Burton - Managing Director of Adisyn *As at market close 5 May 2025 ^As at 31 March 2025 3 Kevin Crofton Non-Executive Chairman Kevin has 3 decades of Semiconductor industry experience. He has held significant management and leadership positions at Lam Research Corporation (Nasdaq:LRCX, US$96B market cap), KLA Corporation (Nasdaq:KLAC, US$91B market cap), Comet Holdings AG (SIX: COTN, CHF1.9B market cap), Newport Corporation (acquired for US$980M), NEXX Systems (acquired by Tokyo Electron) and Aviza Technology. • In 2006, Mr. Crofton led a P/E backed buyout of Aviza Technology UK to create what became SPTS Technologies, where he was President and Managing Director from 2006 to 2020, and created a GBP£500M turnover, highly profitable, market leading company. SPTS was bought by Orbotech, which was later acquired by KLA for $3.4B. • From 2020 through 2022, Kevin was CEO of Comet AG, a listed company on the Swiss SIX exchange. Achieved 60% revenue growth to CHF$600m (A$1.06B), nearly doubling EBITDA performance, and delivered Market Cap growth from 0.8B to 2.2B CHF (~US$2.4 B). • Mr Crofton served on the board of SEMI, the international industry association, for 8 years including as Vice Chair and Chair. • He was advisor to Senator Mark Warner on US CHIPS Act and Gov. Glen Youngkin on Virginia's Semiconductor Initiative. • Throughout his career, Mr Crofton has been recognized for his contributions to the semiconductor industry. He is a published author of numerous technical papers, a sought-after semiconductor industry speaker, and winner of numerous awards including the MEMS Industry CEO of the year (2013) and the Queens Award for innovation, technology and export in 2008, 2014 and 2018. • Mr. Crofton holds an MBA in International Business from American University and a BS Degree in Aerospace Engineering from Virginia Tech. 4 Arye Kohavi CEO of 2D Generation, Director at Adisyn Arye is an Israeli entrepreneur and innovator. He was the founder, president & Co-CEO of WaterGen, which develops water-from-air and air dehumidification technologies. Kohavi holds a MBA (Finance) and a BA in Economics and Accounting, both from the Hebrew University in Jerusalem. Awards: • Arye has been chosen as one of the world's 100 Leading Global Thinkers, and one of the world's top innovators, by “Foreign Policy” magazine. • Water-Gen, founded by Arye, was chosen as one of the World's 50 Most Innovative Companies, by “Fast Company” magazine. • As part of Israel's 70th anniversary celebrations, the Israeli Ministry of Economy and Ynet readers chose Water-Gen as one of the “Nine Greatest Israeli Inventions of All Times”. • Water-Gen's Genny was chosen as one of the world's 100 Best Inventions, by TIME magazine. 5 High Performance Computing’s Primary Need (e.g., AI) Is The Quest for Speed… …But limited by the ability to “shrink” design rules AMAT ITPC November 2024 6 The Copper Interconnect Dilemma… • Smaller and smaller design rules equals more transistors per chip – which means faster performance Delay • But the inherent resistance increases to the point that processing speed is ultimately limited by physics Process technology scale down * Yosi Shacham-diamand, Tetsuya Osaka, Madhav Datta, and Takayuki Ohba. (Book) “Advanced Nanoscale ULSI Interconnects”. 2009. 7 Why Graphene Graphene is a unique carbon structure. It consists of a single atom layer of carbon atoms arranged in a honeycomb lattice and is the world’s first two-dimensional (2D) material. Graphene boasts exceptional properties, highly valuable to the semiconductor industry, including: ✓ Superior Electrical Conductivity: outperforms copper and other traditional materials - ideal for high-speed interconnects ✓ Remarkable Thermal Conductivity: dissipates heat more efficiently than any other known material, making it essential for managing heat in high-performance electronic devices. ✓ Exceptional Strength and Flexibility: stronger than steel and incredibly flexible, opening possibilities for new types of flexible electronics, wearable devices, and other innovative products. ✓ High Transparency: is nearly transparent, making it suitable for applications like displays, touchscreens, and solar cells. 8 The Challenge • For advanced process nodes, the Interconnect is a bottleneck: ❑ Limiting clock and data transfer rates ❑ Consumes a lot of power ❑ Major source of heat generation • Graphene based solutions for the interconnect are well defined, but no suitable industrial process has been identified yet • From imec’s paper* on Graphene for interconnects: “While this study focuses on graphene transfer, a more ‘elegant’ way of depositing graphene would be direct growth on the metal template of interest. Growing highquality graphene requires however high growth temperatures (900-1000°C) and can as such not be applied on interconnect-type of metals.” *https://www.imec-int.com/en/articles/promise-hybrid-graphenemetal-structures-advanced-interconnects 9 2D Generation’s Process • ALD-based • Unique and patented process • Forming graphene directly on the wafer • Use of patented precursors • Low-temperature process • Compatible with current manufacturing limitations • Can be applied using existing industrial processes and equipment 10 Graphene-Coated Interconnects: Unlocking the Future of AI Breakthrough in Semiconductor Interconnects • Graphene-coated interconnects significantly outperform copper in speed and efficiency. • Up to 200x higher electron mobility, enabling faster data transfer across chip architectures. • Reduced resistive heating and minimal signal degradation at nanoscale geometries. Implications for Artificial Intelligence Strategic Relevance • Accelerates AI training and inference by increasing data bandwidth within chips. • Positioned at the intersection of AI growth and next-generation semiconductor innovation. • Enhances energy efficiency, a critical factor in AI data centres and edge AI applications. • Enables denser, more complex chip designs at 3nm and below. • Supports real-time AI on compact devices with minimal power and thermal footprint. • Addresses the critical bottleneck of interconnect performance in AI hardware stacks. • Opens pathways for faster, greener, and more scalable AI systems globally. 11 Beneq ALD Machine State-of-the-Art Atomic Layer Deposition • Procured highly specialised Atomic Layer Deposition (ALD) machine from Beneq, allowing full process development • ALD machines deposit extremely thin layers (down to the atomic layer) of material on to chips • All advanced semiconductor fabs around the globe use ALD • Installation expected in May. The team is already in training at Beneq in Finland. beneq.com 12 Imec Collaboration Imec is the world’s leading semiconductor industry R&D hub ❑ 5,000 researchers from more than 95 countries ❑ 2.5 billion Euro infrastructure, 300mm leading edge semiconductor pilot line ❑ 940M Euro in revenue, a public-private funded entity ❑ Partnered with the world’s leading semiconductor designers, fabricators, and suppliers 2D Generation has a strategic cooperation agreement with imec to validate the company’s technology: 1. Simulation to explore the benefits of the technology in a relevant context for product applications. 2. Physical tests of the graphene coating of several materials (metals and non-metals) and several usages (surfaces, structured wafers, and diffusion barrier). 13 Building the Future Together: Partnership Opportunities 14 ConnectingChips – EU Undertaking Why is the Project significant? 2DG’s role in the Project • The Project is focused on developing and integrating electronic, photonic, power, and RF devices within System in Package (SiP) modules for applications in data centres, highperformance computing, Artificial Intelligence, autonomous vehicles and digital industries. Leveraging graphene’s exceptional properties through pioneering low-temperature ALD techniques, this technology improves semiconductor performance in interconnects, coatings, capping layers by addressing impedance, resistivity, and heat dissipation challenges. • The Project aims to improve heat dissipation, optimize data transmission, implement thermal control for dense SiP modules and advance integration enhance device performance and efficiency. What will it mean for 2DG to be part of the project? • The industry largest players validate 2DG’s innovative approach and establishes its role in the semiconductor industry. • Provides a platform for collaboration and technological advancement. 15 Strategic Partnership with Tel Aviv University Nano Center The Centre’s state-of-the-art facilities, including an 800-square-meter cleanroom, advanced imaging tools, and over 40 fabrication instruments, provide an unparalleled environment for academic and industrial research. The center has collaborated with a diverse range of major multinational companies, including General Electric, Samsung and NVIDIA. ✓ Strategic Partnership: An agreement was signed in March 2025 to accelerate the development of the company’s technology. ✓ Access to World-Class Facilities: Access to advanced equipment. Immediate use of TAU’s Beneq TFS 200 Atomic Layer Deposition (similar to AI1’s system , former generation). ✓ Double ALD capacity: The partnership grants the team access to an additional ALD system to perform parallel development. 16 2DG Intellectual Property Four patent families are directed to the technology of the Company and each patent is composed of our unique production methods and materials: 1 2 3 4 GRAPHENE COATED NON-METALLIC SURFACES, DEVICES AND METHOD THEREOF – directed to the technologies used for conductive diffusion barrier, and other applications GRAPHENE COATED METALLIC SURFACES, DEVICES AND METHOD OF MANUFACTURE THEREOF – directed to the technologies used for conductive capping layer, and other applications METHOD OF MANUFACTURE OF GRAPHENE COATED SURFACES BY ATOMIC OR MOLECULAR LAYER DEPOSITION – directed to graphene manufacture by ALD GRAPHENE METAL COMPOSITE – directed to graphene layers interlayered with metal layers including coatings of patterned surfaces 17 Investment Highlights Disclaimer Adisyn’s wholly-owned subsidiary 2D Generation is developing graphene-based interconnects for the next-generation of semiconductors Opportunity to transform a global market Semiconductor sales expected to almost double by 2030 to ~US$1Tn1 Major early-mover advantage Substantial knowledge and intellectual property developed on graphene deposition over the past four years, offering a significant early-mover advantage World-leading process Unique, patented low-temperature processing method unmatched by any peer of whom the Company is aware, globally Partnerships to drive development Collaboration with the world’s leading semiconductor research institute imec and selected for the EU's Connecting Chips Joint Undertaking potentially collaborating with NVIDIA, Valeo and Applied Materials Landmark agreement augments core research Partnership with Tel Aviv University Nano Center gives access to a second ALD machine to perform parallel development Strong leadership World-renowned semiconductor and technology leaders represented on the Board to drive success 18 1 Kevin Zhang, TSMC, Semiconductor Industry: Present and Future, IEEE solid state Circuit Conference, Feb 2024 Enabling the Future of Semiconductors AI1:ASX Thank you CONTACT DETAILS Blake Burton – Managing Director, AI1 investors@adisyn.com.au David Tasker – IR / PR dtasker@chapteroneadvisors.com.au Ay K 2DG Michael Shaw-Taylor – Corporate Advisor mst@sandtoncapital.com.au av – CEO, 2D G a . m a 19